TECHNICAL DATA SHEET · TDS-R500 · Official source document P50–51 · REV 2026-09
Dedicated dispersant for metal / nano-powder slurriesPhosphate-formulated · Electrostatic repulsion + chelation stabilisation, a dual mechanism
This product is formulated from phosphates — it offers excellent water solubility and high ionic activity. Through the dual action of electrostatic repulsion and chelation stabilisation, it efficiently breaks up agglomerates in ultrafine powders and nanomaterials, and is purpose-built for inorganic, metallic and carbon-based nano-slurry systems such as copper powder, graphene, carbon nanotubes and cerium oxide.
- Density
- 1.025 ~ 1.030 g/mL
- pH (25 °C)
- 8.0 – 9.5
- Solubility
- Fully water-soluble · Miscible in any ratio
- Storage stability
- Sealed: no separation · no precipitation
Zeta field: agglomeration vs. uniform suspension through electrostatic repulsion
Toggle comparison: without R500, micron and nano particles clump together and settle; once added, the dispersant rapidly adsorbs onto particle surfaces, raises the Zeta potential, builds strong electrostatic repulsion and chelates Ca²⁺/Mg²⁺ impurity ions in the water to resist interference.
Adsorbs onto particle surfaces · Zeta potential ↑
It adsorbs rapidly onto the surfaces of copper powder, cerium oxide, graphene and carbon nanotube particles, raising their Zeta potential and generating strong electrostatic repulsion that fully breaks up micron and nano agglomerates — solving the clumping and out-of-specification fineness problems of the slurry.
High-solids slurry viscosity ↓ · Coating uniformity ↑
It effectively lowers the viscosity of high-solids powder slurries, improving slurry flow and coating uniformity and supporting the preparation of high-concentration slurries, without affecting subsequent shaping, sintering or film-forming performance.
Chelates calcium, magnesium and metal impurity ions
It chelates calcium, magnesium and metal impurity ions in the water, preventing impurity-induced flocculation, sedimentation and regrinding coarseness, and greatly improving the storage stability of the slurry.
Product features
Five key features: de-agglomeration, viscosity reduction, chelation, broad compatibility and ready-to-use.
Ultra-strong de-agglomeration
Rapid adsorption onto the surfaces of copper powder, cerium oxide, graphene and carbon nanotube particles raises their Zeta potential and generates strong electrostatic repulsion that fully breaks up micron and nano agglomerates, solving the clumping and out-of-specification fineness problems of the slurry.
Marked viscosity reduction and improved flow
Effectively lowers the viscosity of high-solids powder slurries, improving flow and coating uniformity and supporting high-concentration slurry preparation, without affecting subsequent shaping, sintering or film-forming performance.
Chelation against interference
Chelates calcium, magnesium and metal impurity ions in the water, preventing impurity-induced flocculation, sedimentation and regrinding coarseness, and greatly improving slurry storage stability.
Broad system compatibility · Strong compatibility
Purpose-designed for metal powders, carbon-based nanomaterials and rare-earth oxides; non-volatile, leaves no residue, does not foam, and does not affect the slurry's electrical conductivity, thermal conductivity or sintering performance.
Easy to use · Ready-to-use liquid
No dilution or dissolving required — add it directly, eliminating powder batching, dissolving and filtration steps for higher batching accuracy.
Core technical specifications
Specifications as published in the official TDS, P50; a COA accompanies every batch.
Applicable slurry systems · Recommended dosage
Calculated on powder dry weight (conventional room-temperature aqueous systems); the four slurry categories share a 0–2% scale.
Metal powders
- Ultrafine copper powder
- Nano copper powder aqueous dispersion slurry
Carbon-based nanomaterials
- Graphene powder · Multilayer graphene
- Carbon nanotube (CNT) aqueous slurry
Rare-earth oxides
- Nano cerium oxide powder polishing slurry
- Functional coating slurry
Graphene / carbon nanotube slurries: nanomaterials agglomerate easily, so the dosage may be raised moderately; for high-solids, ultrafine nano powders, fine-tune to 1.0% – 1.5% according to slurry viscosity and dispersion state.
Standard application process · Precautions
Four-step standard process; dispersion passes when there is no separation, no sediment and no floating powder.
Base pre-mixing
First add the dispersant to the pure-water solvent and disperse it evenly throughout the system.
Low-speed stirring 3–5 minStepwise powder addition
Under low-speed stirring, add copper powder, graphene, carbon nanotubes, cerium oxide and other powders slowly in batches to prevent clumping from a single charge and ensure the powder is fully wetted.
In batches · Prevent clumpingFine dispersion
Once charging is complete, apply high-speed stirring, ball milling, sand milling or ultrasonic dispersion as the process requires, fully breaking up powder agglomerates to achieve uniform dispersion.
High speed / ball mill / sand mill / ultrasonicSlurry resting and stabilisation
After dispersion, let the slurry stand to de-aerate; no separation, no sediment and no floating powder means the dispersion has passed.
Stand to de-aerate 10–30 min- This product is only suitable for water-based slurry systems; it is not suitable for oil-based or solvent-based systems.
- Do not combine with strong acids or high-concentration acidic additives, as this may destroy the activity of the dispersion system.
- Do not overdose; an excess slightly raises slurry pH and can affect the performance of some precision slurries, so always run a small trial before production.
- For lightweight carbon nanotube and graphene nano powders, pre-dispersing the dispersant before adding the powder is recommended, as it greatly reduces floating and agglomeration.
- Reseal promptly after opening to avoid moisture pickup and contamination from prolonged exposure, which can affect performance.
Storage and shelf life · Safety information · Sample request
Submit the form on the right and a technical consultant will contact you within 24 hours to arrange a sample.